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Senior Firmware Engineer (OCP DC-SCM/DC-MHS, Protocol Stack & Embedded Systems)

kaizen soft solutions • United State
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AI Summary

Lead the design, implementation, and maintenance of OBMF-ICP protocol stacks and firmware for embedded systems, focusing on hardware bring-up, transport bindings, and OCP collaboration. Drive technical leadership, resolve cross-layer issues, and establish best practices in firmware development for server platforms. Requires deep expertise in embedded C, C++, and OpenBMC with hands-on experience in protocol development and hardware integration.

Key Highlights
Design, implement, and maintain OBMF-ICP protocol stack and core protocol components for server platforms
Lead end-to-end hardware bring-up, including board validation, interface debugging, and firmware readiness
Drive technical leadership, resolve cross-layer issues, and establish firmware best practices in OCP working groups

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Key Responsibilities
Design, implement, and maintain the OBMF-ICP protocol stack and core protocol components for server platforms
Develop and integrate OBMF-ICP transport bindings over USB and MCTP (Message Passing Interface)
Lead end-to-end hardware bring-up, including board validation, interface debugging, and firmware readiness
Represent the program in OCP working-group discussions, reviews, and technical alignment activities
Drive architecture, resolve cross-layer issues, and establish implementation and validation best practices
Technical Skills Required
OpenBMC (Open Board Management Controller) Embedded C and C++ OCP DC-SCM/DC-MHS Protocol Stack

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Nice to Have
DMTF MCTP and PLDM (including PLDM firmware update)
Working knowledge of SPDM (Secure Platform Data Model)
Hands-on experience with USB, I2C/SMBus, I3C, SPI, UART, GPIO, and logic/protocol analyzers
Experience with Zephyr/FreeRTOS and embedded Linux on Arm Cortex-M/RISC-V
Yocto/BitBake, CMake/Meson, Git, and CI/CD pipelines

Job Description

Design, implement, and maintain the OBMF-ICP protocol stack and core protocol components. Develop and integrate OBMF-ICP transport bindings over USB and MCTP.Lead end-to-end hardware bring-up, including board validation, interface debugging, and firmware readiness.Represent the program in OCP working-group discussions, reviews, and technical alignment activities. Drive architecture, resolve cross-layer issues, and establish implementation and validation best practices.Expert in embedded (incl. PLDM firmware update); working knowledge of Hands-on USB, I2C/SMBus, I3C, SPI, UART, GPIO; logic/protocol analyzers, JTAG/SWDRTOS (Zephyr/FreeRTOS) and/or embedded Linux on Arm Cortex-M / RISC-V
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Job Overview
Posted Oct 25, 2026
Employment Full-time
Experience Not Applicable
Location United State
Category Programming
Company kaizen soft solutions
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