Senior Packaging Integration Engineer (Photonic ICs) – InP Foundry

smart photonics • Netherlands

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AI Summary

Bridge frontend photonic design and packaging for InP PICs at SMART Photonics. Establish Design-for-Packaging rules, assess compatibility with industry packaging techniques, and drive yield improvements by integrating backend/reliability data. Collaborate cross-functionally to ensure PICs are packaging-ready by design.

Key Highlights

Own the interface between InP photonic foundry processes and packaging realities

Develop and maintain Design-for-Packaging (DfP) rules and process specs for PICs

Lead packaging-integration for flagship programs, ensuring reliability and yield

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Key Responsibilities

Establish and maintain Design-for-Packaging (DfP) rules and process specifications linking InP foundry capabilities to industry packaging techniques

Assess compatibility of bondpads, metallization stacks, and layout patterns with die attach, wire bonding, fiber alignment, and assembly methods

Translate packaging requirements into PDK updates in collaboration with the Design Enablement team

Coordinate with backend and reliability teams to ensure frontend-to-packaging decisions align with backend and reliability outcomes

Lead packaging-integration aspects of flagship programs, including optimization and compatibility for advanced-stage chips and new platforms

Drive yield improvement by connecting packaging and reliability outcomes with in-line and EOL data

Evaluate supplier/OSAT qualification data, pull/shear tests, and reliability reports to ensure conformance with design rules

Technical Skills Required

Design-for-Packaging (DfX) rules for semiconductor devices Photonic Integrated Circuit (PIC) device design Semiconductor process integration

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Benefits & Perks

Dutch highly skilled migrant visa sponsorship for eligible candidates

Relocation package for international hires

Training and career development (e.g., JePPIX, Six Sigma, Project Management certifications)

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Nice to Have

Hands-on experience with photonic packaging techniques (die attach, wire bonding, fiber alignment, hermetic/non-hermetic assembly)

Experience with InP-based photonics (lasers, modulators, integrated devices)

Ability to interpret reliability data (HTOL, damp heat, thermal cycling) in context of device physics

Experience evaluating supplier/OSAT qualification data

Familiarity with PIC design tools (KLayout, Nazca, Luceda)

Job Description

SMART Photonics B.V. is a pure-play Indium Phosphide (InP) photonic foundry. We work closely with customers across telecom, datacom, sensing, and quantum to turn innovative ideas into high-performance photonic integrated circuits (PICs).

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