Principal Advanced Packaging Engineer (FlexIC WLP/WLCSP & System Integration)

Pragmatic Semiconductor • United Kingdom

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AI Summary

Lead the technical development of advanced semiconductor packaging (FlexIC WLP, WLCSP, die attachment, and system integration) at Pragmatic Semiconductor. Drive cross-functional projects, set technical roadmaps, and ensure manufacturability while collaborating with engineering, operations, and external partners. Requires deep expertise in packaging techniques, project leadership, and reliability qualification with a degree in engineering, materials science, or physics.

Key Highlights

Lead technical development of FlexIC wafer-level packaging (WLP), wafer-level chip-scale packaging (WLCSP), die attachment, and system integration

Drive cross-functional projects, set technical priorities, and collaborate with internal/external stakeholders

Responsible for process development, reliability qualification, and transfer of scalable packaging solutions

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Key Responsibilities

Lead technical development of FlexIC wafer-level packaging (WLP), wafer-level chip-scale packaging (WLCSP), die attachment, and system-level integration processes

Set technical direction, priorities, and development plans, including material selection, process optimization, and supplier/partner coordination

Deliver and demonstrate robust packaging solutions meeting technical, reliability, manufacturability, and program requirements

Provide specialist expertise in wafer debonding, process characterization, and failure analysis

Establish and validate scalable packaging processes with clear process windows and effective team transfers

Make day-to-day technical decisions, resolve development risks, and coordinate priorities across R&D, engineering, operations, and external partners

Technical Skills Required

Semiconductor Packaging (WLP, WLCSP, die attachment, bonding/debonding, encapsulation) Semiconductor Reliability Qualification (JEDEC, IPC, failure analysis) Process Development & Design for Manufacturability (DfM)

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Benefits & Perks

Visa sponsorship

Relocation assistance

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Nice to Have

Project Management qualifications

Experience in MEMS or flexible electronics assembly techniques

Strong knowledge of semiconductor fabrication techniques

Job Description

Overview

We have an excellent opportunity in our Technology group for a Principal Advanced Packaging Engineer to join our growing team!

Based in the North East across our Sedgefield and Durham sites, this is a newly-created role with responsibility for leading the technical development of FlexIC Wafer Level Packaging (WLP), Wafer Level Chip Scale Packaging (WLCSP), die attachment and system level integration.

You will drive the internal roadmap, working with teams such as Product Management, Engineering and Operations, and will apply specialist knowledge to help us achieve our objectives.

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