Lead the technology roadmap, manufacturability, and quality of advanced PCBs and package substrates for AI accelerator silicon, driving embedded passives/actives, inorganic core substrates, and novel thermal solutions. Partner with cross-functional teams and suppliers to develop, qualify, and scale next-gen substrate technologies while ensuring high-yield production and reliability. Own DFM/DFx reviews, supplier quality, and defect analysis to protect product integrity from silicon to system integration.
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