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Senior PCB/Substrate Technology & Supplier Quality Engineer (AI Accelerator)

densityai • United State
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Lead the technology roadmap, manufacturability, and quality of advanced PCBs and package substrates for AI accelerator silicon, driving embedded passives/actives, inorganic core substrates, and novel thermal solutions. Partner with cross-functional teams and suppliers to develop, qualify, and scale next-gen substrate technologies while ensuring high-yield production and reliability. Own DFM/DFx reviews, supplier quality, and defect analysis to protect product integrity from silicon to system integration.

Key Highlights
Own the advanced PCB/substrate technology roadmap for AI accelerators, including embedded passives/actives and inorganic core substrates
Develop and qualify new materials, structures, and processes with vendors, ensuring production readiness and compliance
Lead cross-functional collaboration to enable novel product architectures, DFM/DFx reviews, and supplier quality management
Key Responsibilities
Drive the advanced substrate and PCB technology roadmap aligned with AI accelerator product needs, including embedded passives/actives and inorganic core substrates
Develop and qualify new materials, structures, and processes with substrate/PCB vendors, ensuring transition from evaluation to production readiness
Partner with cross-functional teams (packaging, SI/PI, thermal, mechanical, systems) to improve product architectures, focusing on passive/active embedding, thermal solutions, and reliability
Lead DFM/DFx reviews for high-layer-count PCBs and organic package substrates (flip-chip BGA/ABF) to mitigate manufacturability, yield, and reliability risks pre-tape-out
Qualify suppliers, drive PPAP/first-article processes, and ensure compliance with IPC and internal standards during NPI and volume ramp
Define quality standards, acceptance criteria, and conduct defect/failure analysis (cross-section, metrology, electrical) to root-cause issues and implement corrective actions
Support reliability qualification (thermal cycling, HAST) and use statistical methods (SPC/DOE) to monitor and improve process quality across suppliers
Build DFM guidelines, checklists, and quality processes to scale from prototype to production
Technical Skills Required
PCB/Substrate Manufacturing and Process Development Supplier Quality Management (PPAP, Process Capability, Corrective Actions) Failure Analysis (Cross-Section, Metrology, Electrical Debugging)
Benefits & Perks
Competitive salary ($215,000–$265,000 USD annually)
Equity grant, medical/dental/vision, 401(k), standard PTO
Visa sponsorship for H-1B, O-1, TN, E-3, and other work visas

Job Description

Own the technology roadmap, manufacturability, and quality of the advanced PCBs and package substrates that carry our AI accelerator silicon. You'll drive where our substrate and PCB technology is headed — embedded passives/actives, inorganic core substrates, and novel thermal solutions — while making sure complex, high-layer-count boards and flip-chip organic substrates are designed to build cleanly, at yield, and to spec. Partnering across packaging, thermal, and systems teams and directly with our substrate and PCB manufacturing partners, you'll develop and qualify the new materials, structures, and processes that enable next-generation product architectures — and protect product quality where the silicon meets the system.
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