Design and build the data and compute foundation for physics AI in semiconductor advanced packaging. Own scalable data pipelines, ML platform, distributed GPU training infrastructure, and production model deployment near the manufacturing line. Requires deep experience in data/ML infrastructure, distributed systems, and Python with modern MLOps tooling.
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About Hextrion
Hextrion is a U.S.-headquartered company building next-generation semiconductor advanced packaging for AI chips. As AI chips grow larger and more complex, advanced packaging has become one of the biggest constraints on AI hardware. We combine world-class packaging expertise with frontier physics AI to transform how advanced packages are designed and manufactured. Hextrion is led by former C-suite and senior executives from the leading advanced packaging suppliers to NVIDIA, AMD, Broadcom, Google and Amazon, and our AI team brings together physics AI researchers from Harvard and AI manufacturing experts who have deployed AI systems at leading manufacturers, including TSMC.
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