Principal Technology Development Engineer – GaN / Process Integration

Job Title: Principal Technology Development Engineer – GaN / Process Integration

Description & Requirements:

This position is onsite in Bloomington, MN

Ability and willingness to relocate to the Bloomington, Minnesota area. (relocation assistance available.)

KORE1, a nationwide provider of staffing and recruiting solutions, is seeking a Principal Technology Development Engineer for a leading U.S.-based semiconductor foundry in Bloomington, Minnesota. (Relocation assistance available.)

This is a senior-level technology development and process integration role focused on the development, transfer, optimization, and qualification of advanced semiconductor technologies, including GaN-on-Silicon HEMT power devices.

The ideal candidate brings a strong front-end-of-line (FEOL) semiconductor background, a solid understanding of semiconductor device physics, and true process integration experience. This role requires someone who can look across the complete process flow—not just an individual process module—and understand how changes in lithography, etch, deposition, diffusion, and other processes ultimately affect device electrical performance, manufacturability, and reliability.

This is an opportunity to take significant ownership of technology development while working across multiple engineering disciplines in a growing semiconductor manufacturing environment.

Key Responsibilities

• Lead and contribute to the development, transfer, optimization, and documentation of semiconductor process flows and technology platforms.

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• Develop and integrate process sequences capable of achieving targeted device electrical, reliability, and manufacturability requirements.
• Design and execute experiments to identify optimal process parameters and improve device performance.
• Analyze electrical test, in-process measurement, cross-sectional, inspection, and other characterization data to identify opportunities for process optimization.
• Partner closely with Process Engineering teams across key modules including lithography, etch, thin films, CMP, epitaxy/MOCVD, and related FEOL processes.
• Support initial test-chip and technology-transfer lots, troubleshoot integration issues, and drive toward successful manufacturing introduction.
• Work with Device Engineering to understand device requirements and translate electrical performance targets into process requirements.
• Contribute to layout rules, test structures, and test-chip mask-set development used to characterize new technologies and process dependencies.
• Evaluate new semiconductor technologies and potential technology-transfer opportunities.
• Interpret failure-analysis results and help determine process-related root causes.
• Provide technical leadership and collaborate across Process, Device, Integration, Manufacturing, and other engineering teams.
• Communicate development status, technical findings, risks, and recommendations to senior leadership and external customers.
• Mentor and provide technical guidance to less-experienced engineers.

Required Qualifications

• Significant semiconductor industry experience with a strong background in FEOL technology/process integration.
• Experience working at the device/transistor level and integrating multiple semiconductor process modules to achieve electrical performance targets.
• Strong understanding of semiconductor device physics and the relationship between process conditions and device electrical characteristics.
• Broad understanding of semiconductor fabrication processes and equipment capabilities across multiple FEOL modules.
• Demonstrated experience developing, transferring, or optimizing semiconductor process flows.
• Experience analyzing electrical and process data to troubleshoot device performance and process-integration issues.
• Ability to work cross-functionally with both process/module specialists and device engineers.
• Strong technical leadership, problem-solving, communication, and collaboration skills.
• Degree in Electrical Engineering, Physics, Materials Science, or a closely related technical discipline.
• Ability and willingness to relocate to the Bloomington, Minnesota area. (relocation assistance available.)

Preferred Qualifications

• Experience with GaN-on-Silicon HEMT power devices and/or III-V semiconductor technologies.

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• Knowledge of III-V nitride device physics.
• Process integration experience with CMOS, BCD/BCDMOS, discrete MOSFETs, IGBTs, or other power semiconductor technologies.
• Experience with process and device simulation/TCAD.
• Experience with Design of Experiments (DOE) and semiconductor data-analysis tools such as JMP or Spotfire.
• Experience with failure-analysis techniques, reliability, power packaging, or backend semiconductor processes.
• Experience developing Process, Technology, or Design FMEAs.
• Experience mentoring or technically leading other engineers.

Why Join?

This role offers the opportunity to work in a highly visible technology-development environment where engineers have broad ownership and direct influence over how new semiconductor technologies move from development into manufacturing.

Rather than being limited to a single process module or technology platform, you will collaborate across disciplines, solve complex device and integration challenges, and contribute directly to new technology development and customer programs.

Compensation: The estimated base salary range is $125,000–$165,000, depending on experience, education, skills, and overall qualifications. Additional compensation may include an annual bonus.

Benefits include medical, dental, vision, disability and life insurance, 401(k) with company match, paid time off, annual bonus eligibility, and tuition reimbursement.